金沙js333备用地址|金沙集团下载app

Xmsig and Phoenix Pioneer Sign the Cooperation Agreement

2018.04.17 author:Xiamen Semiconductor

Xiamen Haicang District People's Government and Phoenix Pioneer Technology (PPt) signed the cooperation agreement for the high-end packaging board project and the signing ceremony was held between Xiamen Semiconductor Investment Group Co., Ltd. (Xmsig)and PPt for capital increase and stock expansion on the afternoon of April 16, 2018 in Xiamen. Xmsig and PPt will invest in the development, design and manufacturing base of high-end packaging panels in Haicang District, Xiamen. It is reported that the total investment for the base is 4.6 billion yuan. Located in the information industry park of Haicang District, Xiamen, the base covering 200 acres reaches an annual output value of more than 4 billion yuan. The project is divided into two phases. 2.3 billion yuan will be put into the first phase of the project, the post-production value of which will exceed 2 billion yuan. It is planned to start mass production in the third quarter of 2019. It was the first time when PPt made its public debut as Hengjing’s parent company.

Hu Zhuqing, the chairman of Phoenix Pioneer Technology, suggested that PPt would resort to its exclusive technology named ARMOR in the field of substrate and advanced FCBGA carrier technology to pursue the larger integrated circuit modules (components), higher density and thinner size. The products of PPt are mainly aimed at high performance chips, such as CPU, GPU and FPGA, and applications including AI, 5G, Networking, etc.

"China's development has reached a stage in which we must attach great importance to core technology and satisfy the allocation of scientific and technological resources for independent R&D to get rid of dependence on overseas chips and products. Independent research and development is the most important way for the development of China's integrated circuit industry. The implementation of this project is of symbolic significance to enhance the core competitiveness of packaging board industry in mainland China,” admitted Wang Huilian, director and general manager of Xmsig.


The rise of great powers is closely related to the development of science and technology. We should admit that Made-in-China 2025 cannot be achieved unless technology is available. The implementation of the cooperative investment project is of milestone significance for enhancing the core competitiveness of the packaging board industry in mainland China, while providing Fujian and Xiamen Haicang with the cohesion to improve the industrial chain of IC characteristic manufacturing technology.