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Xiamen Semiconductor Investment Group Co., Ltd and Compass Technology Sign the Cooperation Agreement

2018.05.12 author:Xiamen Semiconductor

Xiamen Semiconductor Investment Group Co., Ltd. (hereinafter referred to as Xmsig) and Compass Technology Co., Ltd. (hereinafter referred to as Compass) signed an investment (M&A) agreement for high-density flexible substrates (flexible substrates) project on the afternoon of May 11 in Haicang, Xiamen.

Left is Zhang Zhihua, the chairman of Compass, and right is Wang Huilian, director and general manager of Xmsig.


It is reported that Xmsig and Jinbai will jointly establish Compass Technology Co., Ltd. (hereinafter referred to as Compass), which will buy Hong Kong Kimberley out, and build a 3kk/month FPC production line in Xiamen Haicang Information Technology Industrial Park. Nearly 730 million yuan will be invested in the first stage of the project, covering the area of about 70 acres. It is expected that the project will be put into operation in 2020 and the annual output value will exceed 1 billion yuan.


With the gradual expansion of semiconductor market, especially in China, which is driven by the emerging markets such as 5G, display panel, intelligent, wearable and Internet of Things, flexible circuit board (FPC) as one of the printed circuit boards with flexibility, light weight, high wiring density and high flexibility enjoys incomparable advantages that can help it become the trend of PCB and new electronic component packaging in the future.


Hence, Xmsig and Compass have decided to invest in the construction of high-density flexible substrate design, research and development and manufacturing base in Haicang, Xiamen. The project will adopt the world's leading high-density, ultra-fine and multi-layer design and technology, focusing on OLED COF, fingerprint identification, optical communications, wearable and vehicle FPC areas.


Wang Huilian, director and general manager of Xmsig, said that Compass is an international team, and the company's technology R&D and operation management could internationalize. The successful signing of this project has filled the vacancy of flexible carrier board for fine lines in China. At the same time, the successful landing of the project marks the beginning of a new stage of development for Haicang.


It is worth mentioning that Xmsig has just completed the signing of a high-end packaging board (hard board) project with Taiwan Hengjin Technology last month. It is reported that the total investment of the project reached 4.6 billion yuan, which will be implemented in two phases. 2.3 billion yuan will be invested for the first phase of the project, reaching a post-production value of more than 2 billion RMB. It is planned to start mass production in the third quarter of 2019. The products are mainly oriented to high performance chips including CPU, GPU and FPGA, and applications, such as AI, 5G, Networking, etc.


It can be said that Xmsig has realized the Hard + Soft industrial layout in terms of sealed test carrier boards in the shortest possible time, which provides support for improving the industrial chain layout for the characteristic technology route of integrated circuits.