Xiamen Semiconductor Investment Group's 2021 Annual Meeting for Investors Successfully Held
2021 Investors Annual Meeting and System Integration and Advanced Package Workshop of Xiamen Semiconductor Investment Group was efficaciously held in Haicang, Xiamen on January 8, 2021. The leaders and visitors from semiconductor enterprise experts, local governments, investment enterprises, companions and funding establishments attended and witnessed, and had a greater in-depth grasp of the prospects of semiconductor industry in Xiamen.
After four years of industrial layout, Xiamen Semiconductor Investment Group Co., Ltd. has constructed a extra whole semiconductor enterprise chain from design, manufacturing to packaging and testing, and has originally formed a product-oriented attribute process, superior packaging industry chain for system integration market demand (wafer-level, provider board technological know-how supported via attribute packaging and other layout), and a group of graph agencies in the main of entrepreneurial type, and has invested in almost 30 enterprises.
Professor.Zhang Bo from University of Electronic Science and Technology of China delivered a speech for this conference, saying that we can see that in simply 4 years of development, Haicang has developed from a “wasteland” of semiconductors to a very important highland of semiconductors in China. It is very rare for Xiamen Semiconductor Investment Group to mix its own judgment and the recommendation of exterior specialists to make some fruitful industrial investments. I would like to thank the Xiamen Semiconductor Investment Group for its high-quality contribution to the complete semiconductor industry, specially in the strength semiconductor industry the place I am located, and wish the annual assembly and Xiamen (Haicang) IC Enterprise Advanced Packaging Seminar a success.
Wang Huilian : the right to development in the subsequent 30 – 50 years, semiconductors as the focal point of competition, and adhering to open development as the cornerstone
Wang Huilian, director and general manager of Xiamen Semiconductor Investment Group, delivered a speech with the theme of “exploring the avenue of semiconductor industry suitable for countrywide conditions and development stage - insisting on doing the proper thing.” He said that in the lengthy history, we have sold precious time at the value of chips, in exchange for the world’s pinnacle computing power infrastructure - cloud computing, and the spring of Chinese chips has just arrived. “
Wang Huilian said: “By today, we are facing the right to development for the subsequent 30-50 years, and semiconductors are the focal point of strategic competition. Regardless of the improvement model, adherence to open development is the cornerstone.”
Looking again to 2020, Wang Huilian stated that the strategic opposition between China and the United States intensified, deepened and has a long-term nature, the stage center of attention from Huawei to the industrial chain, core technological know-how restrictions, suppression extended. External technology, product dependence to make up for the shortcomings of the strategy, the lack of average layout, wonderful initiatives. Global enterprise chain, supply chain facing challenges, forcing the localization of alternative, industrial ecology. 2020 capability scarcity across the board, is expected to proceed to 2021 Q3-4. 2021 is predicted to be a large 12 months for built-in circuits, may additionally rebound after the epidemic.
Wang Huilian in addition said, the “14th Five-Year Plan” opening, the united states will start a number of forward-looking, strategic country wide fundamental science and technology tasks (integrated circuits as the key areas). Based on the Chinese market, industry stage and product innovation, we will explore initiatives that are appropriate for the countrywide conditions and development stage and provide long-term support.
It is really worth noting that Wang Huilian pointed out that “domestic substitution is not the goal, building technological know-how ecology, industrial ecology and talent education device is the future of China’s semiconductor. China and the United States reduce off, technological know-how opposition will convey extra market opportunities, however need to actually become aware of the gap, with awe to deal with the semiconductor industry.”
Cai Jian: System-in-Package / three-dimension integration is an important innovation direction for the improvement of integrated circuit technique
Associate Professor Cai Jian, Party Secretary of Institute of Microelectronics, Tsinghua University, delivered a speech on the theme of “From Advanced Packaging to 3D Integration”. At present, packaging science has started out from single-chip packaging, developed to multi-chip packaging/module, three-d packaging and different stages, and is currently experiencing the improvement stage of system-level packaging and third-dimensional integration.
Cai Jian believes that as Moore’s Law slows down, system-level packaging and third-dimensional integration via ability of practical integration to get rid of the regular development route of dimension dependence has grow to be the key to enlarge Moore’s Law and is an vital innovation direction for the development of built-in circuit technology.
According to the introduction, Professor Cai Jian’s group set up the corporation “Qingxin Integration” in September 2020 and started out the authentic operation in October. Its graph areas consist of excessive complexity processors, optoelectronic packaging, quantum packaging, detector packaging, etc.; in 2021, it plans to build the simple structure, complete the ornament of the ultra-clean room, comprehend the basic packaging manner functionality and start the small extent business.
Huang Junhua from Shilan Jike: China’s IC industry desires to work in excessive profile and behave in low profile
Huang Junhua, General Manager of Xiamen Shilan Jike Microelectronics Co., Ltd. delivered a speech on the theme of “Based on Haicang, catch the moment, and do some thing practical about semiconductors”. Huang Junhua pointed out: “When you advertise ‘big fund’ investment everywhere in the IC discipline publicly, as a rising force, it will make the contemporary dominant pressure experience nervous. In order to speed up industrial upgrading, a good deal large scale of cash has been injected, however quietly.
Since its institution in 1997, Shilan Microelectronics has at the start possessed the genes anticipated of an IDM enterprise. Huang Junhua said, Shilan Microelectronics’s purpose is to be China’s Infineon, we have 5-inch, 6-inch, 8-inch and third-generation semiconductor Fabs in Hangzhou, we have our very own packaging and trying out manufacturing unit in Chengdu, our products are one of the few domestic semiconductor agencies that can enter industrial and automotive grade.
In 2020, Shilan's 12-inch area of expertise procedure chip manufacturing line will be put into production and attain the mass production level of 6K in December, and is predicted to attain the mass manufacturing capacity of 40K in the first half of 2022. Looking ahead, Huang Junhua said, based totally on Haicang, Shilan Jike ought to catch the opportunities in 2020 and 2021, coalesce its will and do matters in a practical way.
Fengxiang Yu of Tongfu Microelectronics: The dilemma of display driver chip industry chain and the development strategy of package and test houses
Dr. Fengxiang Yu from Tomflight Microelectronics gave a speech entitled “Overview of Display Driver Chips”. At present, there are two kinds of driver IC packages for mobile phones, tablets and TVs: COG for small displays and COF for large screens, and in recent years, smartphones are moving in the direction of the full-screen era, so the package deal is transferring from COG to COF.
In terms of the driver IC market for TVs and monitors, Taiwan-based manufacturers, led through United Wing Technology, are the dominant players. Next, Korean producers are placed in the back of Taiwanese producers because they have their personal panel enterprise to guide them. At present, some diagram agencies in mainland China are also catching up. Mainland China’s panel manufacturing is already the world’s first, which is a very exact possibility for IC sketch companies.
Regarding the development strategies of driver chip packaging and test houses in the past two years, Yu Fengxiang pointed out four major trends, one is to enter into the key materials, such as Xinbang and Yi Siwei entering the production of tape for COF; the second is to close the relationship with panel factory customers, such as Xinzhong joining Yi Siwei Group; the third is to provide full service and various packaging services to cover the driver chip packaging and test business interactively, such as Tongfu Microelectronics and Xinbang's recent acquisition of packaging and test house Huatai; the fourth is to win the world by testing, and strive to purchase testing machines.
Kong Lingwen from Anjie Limeiwei: Domestic packaging substrates are in the introduction and growth period, with greater room for increase
Kong Lingwen, vice chairman of Agile Meadville Electronics, delivered a keynote speech on “the modern-day situation, outlook and backbone organizations of China’s packaging substrate industry development”. According to Kong, at present, the market dimension of integrated circuit is extra than four hundred billion dollars, with an common annual growth rate of 6.3%, and the market measurement of packaging substrate bills for 1/7 of the PCB market size, that is, if the PCB market dimension is 70 billion dollars, then the packaging substrate is 10 billion dollars.
At present, home packaging substrate products are in the introduction period and growth period, with a massive boom space. Kong Lingwen said, “China’s packaging industry has the basis to enter the high-end after the market and countrywide policies; at present, the domestic packaging substrate nevertheless can not meet the home demand, while the gear and substances can not meet the substrate home demand; and with the non-stop development of the industry, the future development of packaging and substrate enterprise will have a tendency to deep integration.”
In order to enhance manufacturing ability as properly as technological know-how level, Anjieli additionally joint Xiamen state-owned acquisition of Shanghai and Guangzhou business of Meiwei, can rapidly decorate China’s packaging substrate and classification substrate scale manufacturing capacity, about 3 billion class substrate and packaging substrate business, in order to in addition meet the domestic market demand.
Yu Daquan: Diversification of integrated circuit applications will be the main challenge for package integration
Yu Daquan, General Manager of Xiamen Yuntian Semiconductor Technology Co., Ltd. delivered a speech on the theme of “Embracing the New Era of Advanced Packaging”. Yu Daquan stated that the diversification of IC purposes will be the major undertaking for packaging and integration.
Yu Daquan pointed out that, with the diversification of integrated circuit applications, emerging areas put forward greater requirements for advanced packaging, packaging technological know-how is creating rapidly. At present, superior packaging is increasingly becoming an essential capacity to proceed and expand Moore’s Law, superior packaging from mid-channel science to front-channel science evolution, line width accuracy to sub-micron 5G high-speed, high-frequency to package integration put ahead new challenges, heterogeneous integration, micro-system integration greater difficult new challenges.
Yu Daquan said, Yuntian Semiconductor from 5G RF as a breakthrough, to supply machine integration and packaging options to assist customers to catch the 5G, with “characteristic technique + advanced packaging + solutions” model, to discover the new era of advanced packaging technological know-how industrialization. We have made a series of breakthroughs in RF front-end devices, filter packaging, modules, IPD, chip and antenna integration, and hope to make our personal contribution to China Core.
In addition to the above, Professor Zhu Yu from the Department of Mechanical Engineering of Tsinghua University, Professor Li Xinxin from the Shanghai Institute of Microsystems of the Chinese Academy of Sciences, CTO Ding Xiaoguo from Nanjing TECH and General Manager Xu Dehui from Shanghai Yeying Electronics Technology Co. (Proofreading/GY)