Xiamen Semiconductor and many investment companies won the "Industry Chain Cooperation Award"
On the afternoon of March 20, the 4th "IC Innovation Award" ceremony held by China Integrated Circuit Innovation Alliance was jointly held in Beijing and Shanghai. Xiamen Semiconductor Investment Group Co., Ltd. unites Xiamen Silan Microchip Manufacturing Co., Ltd., Xiamen Silan Advanced Compound Semiconductor Co., Ltd., Xiamen Tongfu Microelectronics Co., Ltd., Xiamen Sky Semiconductor Technology Co., Ltd. and Kaiyuan Communications Technology (Xiamen) Co., Ltd. , Based on the "three-chain integration" of the industrial chain, the innovation chain, and the financial chain to make certain breakthroughs in promoting the new model of China's semiconductor industry development, and jointly won the industrial chain cooperation award.
“Among all participating units of the award, Haicang Integrated Circuit Enterprise's comprehensive score ranks in the top. Experts agreed that the development positioning, model and measures of Haicang Integrated Circuit are innovative in China and even exceed the standards and expectations at the beginning of the award. " According to Wang Huilian, who is the general manager of Xiamen Semiconductor Investment Group, Haicang has an international perspective, which insists on deep cultivation in subdivisions, precise positioning of the industry, relying on professional teams, establishing professional platforms, and insisting on varying development. It has built a relatively complete integration in 4 years. circuit Industry chain layout, covering: chip design, manufacturing (special craft), packaging, carrier board and equipment industry chain layout. The layout of the advanced packaging and substrate industry chain in the later stage has formed a late-comer advantage, and the effect of industry clustering and talent clustering is prominent. Under the current situation, the layout of the IC industry chain and some semiconductor projects formed by Haicang have highlighted the huge industrial value and economic value, especially in response to the card neck technology and key areas of the industry chain security and other aspects have played a huge role. Haicang has obtained a solid foundation for development with minimal cost and has explored an integrated circuit industry model suitable for its own development, which has provided valuable experience and regional practice for exploring the development of integrated circuit industry under the national system.
Speech by Cao Jianlin, Chairman of China Integrated Circuit Innovation Alliance
Speech by Xiang Libin, Vice Minister of the Ministry of Science and Technology
Speech by Ye Tianchun, 02special Chief Technical engineer
Report by Wang Huilian, General Manager of Xiamen Semiconductor Investment Group
Introduction of China Integrated Circuit Innovation Alliance:
China Integrated Circuit Innovation Alliance is composed of leading domestic enterprises, universities, research institutes and social organizations engaged in the fields of Internet applications, information system integration, integrated circuit design, integrated circuit manufacturing, integrated circuit packaging and testing, integrated circuit equipment materials and parts and components. It is equivalent to co-sponsored and established in Beijing on March 22, 2017. The alliance will be guided by the national strategy, with the goal of breaking through the cutting-edge technology of integrated circuits, encouraging open innovation, promoting exchanges and cooperation in all links of the industrial chain, and optimizing the ecological environment for industrial technology innovation; exploring new mechanisms for synergy of various resources to gather alliances Innovative resources and strength at home and abroad, domestic and international, promote the rapid improvement of industrial technology; promote "core electronic devices, high-end general-purpose chips and basic software products", "very large-scale integrated circuit manufacturing equipment and complete processes", "new generation broadband The docking and in-depth integration of 3 major national scientific and technological achievements including "wireless mobile communication network”; in-depth and systematic research on the sustainable development strategy of technological innovation in the integrated circuit industry will provide support for the smooth implementation of major special projects in the electronics and information field during the 13th Five-Year Plan period and subsequent collaborative innovation of integrated circuits.